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Packging cleaning Packging cleaning

Packging cleaning

Packging cleaning

Chip level packaging is soldered at nm level intervals, and the active agent and other hygroscopic substances left behind by the soldering flux. If there is a small amount of hygroscopic active agent in the smaller layer spacing, it can occupy a relatively large chip space, affecting chip reliability. To remove residues from a limited space, cleaning agents need to have low surface tension to penetrate into the interlayer chips, achieving the goal of removing residues.
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