W3000W3000D-1W3100W3210

Used to remove flux, solder paste, and solder paste residues from PCBA, packaging devices, and power electronics. This product can effectively remove solder paste, solder paste, and flux residues on various semiconductor electronic devices. For flip chip, semiconductor sealing water-based environmental cleaning, PoP stacked chips, SIP system packaging, semiconductor chips, semiconductor power devices, power modules (photoelectric modules, sensing modules, communication modules), power electronics, IGBT power modules, DCB power cleaning, lead frame, BGA ball planting cleaning, discrete devices Electronic components and other components have excellent cleaning effects.